******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 2.2
* @date    27-February-2024
* @brief   MB1280 manufacturing files package
******************************************************************************
* COPYRIGHT(c) 2024 STMicroelectronics
*
* The Open Platform License Agreement (Agreement) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (ST), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* Reference Material), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************
* 2.2 - 27-February-2024
==========================
    + Update package structure for revisions A and B.
=========================
* 2.1 - 17-April-2023 
=========================
    + Update the struture of rev C package.
    + No 3D files available.

=========================
* 2.0 - 04-December-2019
=========================
    + Update MOSFETs wrong direction issue.

=========================
* 1.0 - 29-November-2018
=========================
    + First official release.

******************* (C) COPYRIGHT 2024 STMicroelectronics *****END OF FILE
