******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 2.0
* @date    17-Sep-2021 
* @brief   MB1352 board design project package
******************************************************************************
* COPYRIGHT(c) 2021 STMicroelectronics
*
* The Open Platform License Agreement (“Agreement”) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (“ST”), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* “Reference Material”), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************
========================
* 2.0 17-Sep-2021
========================
    + Add variant "G0C1E" which only used for STM32G0C1E-EV product.
	SB49, SB50, SB54, SB55, SB62, SB63, SB64, SB65 from 0R to NC
	SB16, SB17, SB27, SB28, SB60, SB61, SB66, SB67 from NC to 0R
	R1, R2 from 10K to NC
	C19, C20, C21, C22 from 100nF to NC
	CN1, CN4 from USB type C connector to NC
	JP3 from header to NC

========================
* 1.0 - 18-Oct-2018
========================
    + First official release.
  
******************* (C) COPYRIGHT 2021 STMicroelectronics *****END OF FILE
