******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 5.0
* @date    10-October-2024  
* @brief   MB1381 board design project files package 
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* COPYRIGHT(c) 2024 STMicroelectronics
*
* The Open Platform License Agreement (“Agreement”) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (“ST”), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* “Reference Material”), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************
* 5.0 - 10-October-2024 
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    + Change the reference of the LCD from ROCKTECH RK043FN48H-CT672B to ROCKTECH RK043FN88H-CT661C in the revision B.
    + Change the reference of the Memory from Frida LCD Micron Technology-MTFC4GACAJCN-1M WT to KIOXIA-THGBMTG5D1LBAI in the revision B.

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* 4.0 - 15-September-2023
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    + Missing versions were added.

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* 3.0 - 03-August-2022
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    +Reworked package with consistent data and added version B03.

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* 2.0 - 08-July-2020
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    + MB1381-B02 design resource added.
    + the configuration of SMPS related solder bridges is managed by variant of H75XB and H745XI. no change of real product.

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* 1.0 - 16-November-2018
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    + First official release
  
******************* (C) COPYRIGHT 2024 STMicroelectronics *****END OF FILE
