******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version 2.1
* @date    17-April-2025    
* @brief   MB1397 manufacturing files package
******************************************************************************
* COPYRIGHT(c) 2025 STMicroelectronics
*
* The Open Platform License Agreement (“Agreement”) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (“ST”), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* “Reference Material”), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************
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* 1.0 - 27-February-2019
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    + First official release.

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* 2.0 - 28-March-2023
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    + Component change due to obsolescence
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* 2.1 - 17-April-2025 
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    + Update Manufacturing structure
    + Add mechanical files for MB1397-G474EMC-B06
  
******************* (C) COPYRIGHT 2025 STMicroelectronics *****END OF FILE
