******************************************************************************
* @file     readme.txt
* @author   WBL Boards & Module Team
* @version  3.0
* @date     04-April-2024
* @brief    MB1801 manufacturing files package
******************************************************************************
* COPYRIGHT(c) 2024 STMicroelectronics
*
* The Open Platform License Agreement (“Agreement”) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (“ST”), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* “Reference Material”), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************

========================
* 3.0 - 04-April-2024
========================
Revision D03   
    SB30 Fitted 

========================
* 2.0 - 14-February-2024
========================
Revision D02    
    Remove STLINK-V3MODS 
    Include STLINK-V3EC
    Add level shifter on VCP2
    Remove pull-up on Push-Buttons (B1 & B2 & B3) 

========================
* 1.0 - 01-September-2023
========================
Revision A01
    + First official release.
  
******************* (C) COPYRIGHT 2024 STMicroelectronics *****END OF FILE
